1/4 rev. g structure silicon monolit hic integrated circuit product series 2-phase half-wave pre driver for fan motor type ? features lock detection, automatic restart circuit absolute maximum ratings parameter symbol limit unit supply voltage vcc 30 v power dissipation pd 624 mw operating temperature topr -40 +100 storage temperature ts t g - 5 5 +125 output current iomax 70 ma al signal output current ial 8 ma al signal output voltage val 30 v junction temperature tjmax 125 reduce by 6.24mw/ over ta=25 (on 70.0mm 70.0mm 1.6mm glass epoxy board) operating conditions parameter symbol limit unit operating supply voltage range vcc 4.0 28.0 v hall input voltage range vh 1.0 vcc-0.5 v this product is not designed for production against radioactive rays.
2/4 rev. g electrical characteristics (unl ess otherwise specified ta=25 ,vcc=12v) parameter symbol limit unit conditions min. typ. max. circuit current icc - 3.2 5.0 ma at output off hall input hysteresis vhys 3 - 15 mv al output l voltage val - - 0.5 v ial=5ma al current capacity ial 8.0 - - ma val=2v charge current of capacitor for lock detection ildc 2.0 3.45 5.25 a vld=1.5v discharge current of capacitor for lock detection ildd 0.35 0.80 1.45 a vld=1.5v charge-discharge current ratio of capacitor for lock detection rcd 3 4.5 8 - rcd=ildc/ildd clamp voltage of capacitor for lock detection vldcl 2.2 2.6 3.0 v comparison voltage of capacitor for lock detection vldcp 0.4 0.6 0.8 v output h voltage voh 10 10.5 - v io=10ma
3/4 rev. g package outlines block diagram te r m i n a l n a m e pin no. terminal name 1 vcc 2 h+ 3 al 4 h- 5 gnd 6 ld 7 a1 8 a2 logic 1 2 3 4 8 7 6 5 lock detect auto restart reg vcc h+ a l h- gnd ld a 1 a 2 + - hall amp + - + - 0.3min. 0.150.1 0.40.1 0.11 6.20.3 4.40.2 5.00.2 85 41 1.27 1.50.1 0.1 6406 lot no.
4/4 rev. g cautions on use 1) absolute maximum ratings an excess in the absolute maximum rations, such as supply vo ltage, temperature range of operat ing conditions, et c., can break down the devices, thus making impossible to identify breaking mode, such as a short ci rcuit or an open circuit. if any over rat ed values will expect to exceed the absolute maximum ratings, consider adding circui t protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecti ng the power supply lines. an external direction diode can be added. 3) power supply line back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and gnd for routing regenerated current. and fully ensure that the capacitor characteristics have no probl em before determine a capacitor value. (when appl ying electrolytic capacitors, capacitance characteristic values are reduced at lo w temperatures) 4) gnd potential the potential of gnd pin must be minimum potential in all operating conditions. also ensure that all terminals except gnd termi nal do not fall below gnd voltage including transient characteristics. however, it is possi ble that the motor output terminal may d eflect below gnd because of influence by back electromotive force of motor. malfunction may possibly occur depending on use condition, environment, and property of individual motor. please make fully confirmation that no problem is found on operation of ic. 5) thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation(pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic for m ounting on printed circuit boards. the ic ma y be damaged if there is any connection er ror or if pins are shorted together. 7) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doi ng so may cause the ic to malfunction. 8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum rations or aso. 9) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. alwa ys discharge capacitors after each process or st ep. always turn the ic?s power supply off before connecting it to or removing it f rom a jig or fixture during the inspection process. ground the ic dur ing assembly steps as an antistatic measure. use similar precaut ion when transporting or storing the ic. 10) gnd wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground volt age. be careful not to change the gnd wiring pattern of any ext ernal components, either. 11) capacitor between output and gnd when a large capacitor is connected between output and gnd, if vcc is shorted with 0v or gnd for some cause, it is possible tha t the current charged in the capacitor may flow into the output resulting in destruction. keep the capacitor between output and g nd below 100uf. 12) ic terminal input when vcc voltage is not applied to ic, do not apply voltage to each input terminal. when voltage above vcc or below gnd is applied to the input terminal, parasitic elem ent is actuated due to the structure of ic . operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the la st. do not use in a manner where parasi tic element is actuated.
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